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NTD12N10
Power MOSFET
12 Amps, 100 Volts
N ? Channel Enhancement ? Mode DPAK
Features
http://onsemi.com
? Source ? to ? Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
? Avalanche Energy Specified
? I DSS and R DS(on) Specified at Elevated Temperature
? Mounting Information Provided for the DPAK Package
? These are Pb ? Free Devices
V (BR)DSS
100 V
R DS(on) TYP
165 m W @ 10 V
N ? Channel
D
I D MAX
12 A
Typical Applications
? PWM Motor Controls
? Power Supplies
? Converters
G
S
MAXIMUM RATINGS (T C = 25 ° C unless otherwise noted)
Rating Symbol
Drain ? to ? Source Voltage V DSS
Value
100
Unit
Vdc
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain ? to ? Source Voltage (R GS = 1.0 M W )
V DGR
100
Vdc
Drain
Gate ? to ? Source Voltage
? Continuous
? Non ? Repetitive (t p ≤ 10 ms)
Drain Current ? Continuous @ T A = 25 ° C
? Continuous @ T A =100 ° C
? Pulsed (Note 3)
Total Power Dissipation
Derate above 25 ° C
Total Power Dissipation @ T A = 25 ° C (Note 1)
Total Power Dissipation @ T A = 25 ° C (Note 2)
Operating and Storage Temperature Range
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 50 Vdc, V GS = 10 Vdc,
I L = 12 Apk, L = 1.0 mH, R G = 25 W )
V GS
V GSM
I D
I D
I DM
P D
T J , T stg
E AS
± 20
± 30
12
7.0
36
56.6
0.38
1.76
1.28
? 55 to
+175
75
Vdc
Vpk
Adc
Apk
W
W/ ° C
W
W
° C
mJ
1 2
1
2
3
3
4
4
DPAK
CASE 369C
(Surface Mount)
STYLE 2
1
Gate
DPAK
CASE 369D
(Straight Lead)
STYLE 2
2
Drain
4
Drain
3
Source
Thermal Resistance
? Junction to Case
? Junction to Ambient (Note 1)
? Junction to Ambient (Note 2)
Maximum Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
R q JC
R q JA
R q JA
T L
2.65
85
117
260
° C/W
° C
Y
WW
T12N10
1 2 3
Gate Drain Source
= Year
= Work Week
= Device Code
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using the minimum recommended
pad size.
3. Pulse Test: Pulse Width = 10 m s, Duty Cycle = 2%.
G = Pb ? Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
? Semiconductor Components Industries, LLC, 2010
May, 2010 ? Rev. 8
1
Publication Order Number:
NTD12N10/D
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